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- Computer memory specialist 4DS Memory (4DS) has updated the market on the development if its memory technology
- During the lockdown, the company tested its Initial Platform Lot of 300 millimetres wafers, these wafers have 4DS’ memory with imec’s megabit platform
- The testing is to get a better understanding on how the technologies work together
- Additionally, 4DS has also completed the extra 300 millimetres Additional Wafers Lot, with the help from HGST and imec
- The additional wafers were at the highest speed and endurance the company has ever recorded
- On Market close, 4DS remains steady and is selling shares for 5.3 cents each
Computer memory specialist 4DS Memory (4DS) has updated the market on the development of its memory technology.
Initial Platform Lot
During the lockdown, the company completed the analysis on its Initial Platform Lot of 300 millimetres wafers. These wafers have 4DS’ memory with imec’s megabit platform.
The testing is an important step in integrating the technologies.
“The information gathered from this testing has enabled 4DS to identify which process steps will be further tuned, to benefit future platform iterations,” the company said.
The analysis was completed prior to HGST, subsidiary of Western Digital Corporation, joining the 4DS/imec collaboration. Last month, HGST renewed their joint venture agreement to enhanced 4DS’s data storage and memory technology.
Additional Wafers Lot
4DS has also completed the extra 300 millimetres Additional Wafers Lot, with the help from HGST and imec.
The extra wafers have sped up 4DS goals of developing a repeatable process for producing 4DS’ memory and “demonstrating this process by fabricating a 4DS megabit memory on imec’s platform with high endurance and read speed comparable to dynamic random-access memory (DRAM),” the company stated.
The additional wafers were at the highest speed and endurance the company has ever recorded.
“We are delighted with the continued support we receive from imec and Western Digital/HGST and their contributions to the fabrication process,” 4DS CEO Dr Guido Arnout said.
“These results confirm that we have made a giant step closer to our goal of fabricating a megabit memory device suitable for Storage Class Memory in a state-of-the-art fab,” he added.
What’s next?
As soon as the COVID-19 restrictions were eased, 4DS has changed its lab to new standards that have been set out by the virus, such as social distancing and hygiene requirements, so that the wafer testing could continue safely in early June.
The analysis of the additional Wafers and Initial Platform Lot will form a pathway to ensure the best outcome can be achieved. The company now has a better understanding of the process and steps required.
4DS will continue to work with imec and HGST in July and will update the market in its quarterly report at the end of July.
On Market close, 4DS remains steady and is selling shares for 5.3 cents each.
